Kevin Cheng to Speak at BSSM's 19th International Conference on Advances in Experimental Mechanics

The British Society for Strain Measurement (BSSM) will host its 19th International Conference on Advances in Experimental Mechanics at Imperial College London, UK from September 2–4, 2025. The event brings together leading international researchers from academia and industry to share insights and innovations in experimental solid mechanics.

Kevin Cheng Presentation Details

Topic: Exploring the Application of High-Speed Camera in Digital Image Correlation (DIC)

Date: September 2, 2025

Time: 11:00–11:20

Location: Skemp 201, Imperial College London, UK

Kevin Cheng - Europe Sales Director will present how high-speed cameras are transforming the accuracy and depth of Digital Image Correlation (DIC). His talk will highlight practical applications in industries that demand precise strain and deformation measurement.

What is Digital Image Correlation (DIC)

Digital Image Correlation (DIC) is a non-contact optical method for measuring strain, displacement, and deformation. It works by analyzing two digital images of a specimen before and after loading. The technique is also called Digital Speckle Correlation.

DIC enables high-resolution tracking of changes in structures under stress, making it widely used in aerospace, automotive, rail, biomedical, energy, and civil engineering research.

Applications of High-Speed Camera in DIC

Kevin Cheng will showcase real-world cases where high-speed cameras play a crucial role in DIC analysis and here are some highlights:

Concrete Strain Measurement: Accurate monitoring of concrete under heavy loads to improve safety and performance in construction.

Rotation Test: Tracking rotational deformation in mechanical structures with high temporal precision.

Bridge Impact Test: Capturing structural responses during sudden impact to evaluate bridge resilience.

Metal Crush Test: Recording fast deformation in crash tests for automotive safety design.

These applications underline how high-speed imaging strengthens experimental mechanics by capturing rapid events invisible to standard cameras.

SinceVision at BSSM 2025

SinceVision will also participate as an exhibitor at the conference. Visitors will have the chance to meet experts and explore advanced high-speed camera solutions for experimental mechanics.

Exhibition Dates: September 2–4, 2025

Venue: Imperial College London, UK

Booth: No. 16

Why Attend Kevin Cheng’s Talk

Attendees will gain insights into how high-speed imaging technology supports advanced Digital Image Correlation research. Kevin’s session will demonstrate how DIC combined with high-speed cameras improves measurement accuracy in dynamic testing.

The BSSM 19th International Conference is a leading platform for researchers and industry experts in experimental mechanics. Kevin Cheng’s presentation will highlight the growing role of high-speed cameras in advancing DIC applications across industries.

Visit SinceVision at Booth 16 to connect with our experts and learn more about our innovations in high-speed imaging.

Book a meeting with us at info@sincevision.com or visit us.