Semiconductor Chip-Picking Process with SinceVision High-Speed Camera

Industry pain points and demands

The semiconductor chip-picking process requires precise motion control, as even minimal misalignments or pressure inconsistencies can lead to damaged chips and reduced yield.

SinceVision's high-speed cameras can record every subtle motion at thousands of frames per second with high resolution, enabling detailed observation of the chip-picking head's precise contact with the chip surface, application of appropriate pressure, and smooth lifting of the chip.

Through slow-motion playback, minor interactions during the process, such as contact precision and tool alignment, are revealed. These insights are crucial for understanding and ensuring the delicate control needed for successful operation. The data captured by high-speed cameras allow engineers to identify potential issues, such as poor chip adhesion or robotic arm misalignment, providing valuable information to refine and enhance manufacturing processes effectively.