Wafer Edge Detection in HJT Cells with SinceVision 3D Laser Profiler

Industry pain points and demands

When silicon wafers overlap on the carrier, the suction cup of the robot in the loading and unloading process will crush the silicon wafers, causing damage to the silicon wafers. If fragments and foreign objects enter, it will easily contaminate the vacuum chamber after the high-temperature process, affecting production and increasing maintenance costs. Therefore, it is necessary to control the overlapping of silicon wafers on the carrier.

• Overlapping Wafers: Misalignment and overlapping during robot handling cause wafer breakage, leading to increased defects.

• Contamination Hazards: Fragments and foreign particles from broken wafers risk contaminating the vacuum chamber, disrupting production and escalating maintenance costs.

• High-Temperature Sensitivity: Misaligned wafers in high-temperature processes can lead to further damage and operational inefficiencies.